HS 3818Electronics

HS Code for Semiconductor Wafers (HS 3818)

Doped silicon (and germanium, gallium arsenide) wafers for semiconductor manufacture sit under HS 3818. Undoped polysilicon is 2804.61. The regulatory choke-point is US export controls on advanced-node fabrication equipment and finished chips to China, mirrored by the Netherlands and Japan (ASML, Tokyo Electron).

Reviewed against WCO HS · WTO IDB · National customs schedules3 authoritative sourcesLast reviewed July 2026

Sample 6-digit codes

Code	Description
3818.00	Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms
2804.61	Silicon containing >= 99.99% by weight of silicon
8542.31	Processors and controllers (finished chips)
8486.20	Machines and apparatus for the manufacture of semiconductor devices (equipment)

Need to check a specific code? Use the free HS code lookup tool.

Typical import duty by market

Market	Duty
European Union	0% ITA-covered; EU Chips Act subsidises fabs.
United States	0% Plus 25% Section 301 on Chinese-origin semiconductor items from 2025.
China	0-4% Plus 13% VAT; China Big Fund invests in domestic capacity.
India	0-4% Semicon India Programme subsidies for OSAT / ATMP.

Worked landed-cost example

1,000 x 300mm silicon wafers epi-doped for logic, FOB Kaohsiung USD 350/each, CIF Frankfurt

FOB valueUSD 350,000

Freight + insurance (air, clean-room packing)USD 8,000

CIF valueUSD 358,000

EU dutyUSD 0

Landed cost ≈ USD 358,000. Export-control screening (ECCN, end-user, end-use) is the primary compliance workstream, not duty.

Run your own numbers in the import duty & tax calculator.

Regulatory checkpoints

· US EAR ECCN 3B001, 3B002 (equipment), 3D001, 3E001 - advanced-node fabrication controls to China from Oct 2022; expanded Oct 2023 and 2024.
· Netherlands and Japan export controls on ASML EUV/DUV lithography and TEL etch/deposition to China.
· EU Chips Act (Regulation 2023/1781) - EUR 43bn framework; support for pilot lines and fabs.
· US CHIPS and Science Act - USD 52bn subsidy plus 25% ITC for fab construction.
· Foreign Direct Product Rule (FDPR) extensions - most-controversial extraterritorial reach.

Top exporting countries

· Taiwan (TSMC)
· South Korea (Samsung, SK Hynix)
· USA (Intel, Micron)
· Netherlands (ASML equipment)
· Japan (TEL, wafer materials)

Frequently asked questions

How is polysilicon classified vs wafer?

Polysilicon feedstock is 2804.61 (chemical). Once cast into ingots, sliced, polished and doped for electronic use, it becomes 3818. Solar-grade polysilicon that never enters semiconductor use often stays in 2804.61.

What are the US chip-export controls to China?

The Oct 2022, Oct 2023 and Dec 2024 rules restrict export to China of: (i) logic chips at advanced nodes, (ii) HBM memory above stipulated performance, (iii) EUV/DUV lithography, (iv) etch, deposition, and inspection tools, (v) US-person support to specified fabs. FDPR extends controls to foreign-made items using US technology.